| Thermopile Surface Heat-Flux Sensor |
A series of thermocouples measures the temperature difference across a calibrated thermal-resistance layer. The output voltage is proportional to heat flux. |
Approximately 0.1 W/m² to 100 kW/m², depending on construction and calibration. |
Usually tens of milliseconds to several seconds. |
Commonly about −40 to 200 °C for general-purpose surface units; higher-temperature designs are available. |
Direct heat-flux measurement, compact size, low power requirement, and suitability for steady or slowly changing thermal loads. |
The reading can be affected by contact resistance, mounting pressure, surface curvature, and temperature-dependent calibration. |
Building envelopes, insulation testing, heat exchangers, electronics cooling, furnaces, and process equipment. |
| Gardon Gauge |
A thin circular foil is heated by incident radiation. The temperature difference between the foil center and its cooled edge generates a thermoelectric signal proportional to radiant heat flux. |
Commonly about 1 to 200 kW/m²; specialized designs can cover wider ranges. |
Typically about 0.1 to 2 seconds. |
Often used with water cooling; the sensing foil may operate at high temperatures while the body is actively cooled. |
High radiant-flux capability, robust construction, and good suitability for fire and combustion experiments. |
Requires cooling and flow control; mainly measures radiation and can be influenced by convection, window transmission, and spectral effects. |
Fire testing, combustion research, radiant panels, high-temperature furnaces, and aerospace thermal environments. |
| Schmidt–Boelter Gauge |
A water-cooled, temperature-sensitive surface uses thermopile junctions to measure the temperature rise caused by incident radiant energy. |
Typically about 0.5 to 100 kW/m², with range determined by geometry, cooling, and calibration. |
Approximately 0.1 to 1 second in many practical configurations. |
Designed for high radiant exposure with water cooling; allowable body and sensing-surface temperatures depend on the construction. |
Good sensitivity, relatively broad spectral response, and established use in fire-radiation measurements. |
Needs a stable cooling-water circuit; calibration depends on emissivity, flow rate, viewing angle, and environmental conditions. |
Fire exposure tests, building-material studies, radiant heat sources, and combustion laboratories. |
| Thin-Film Heat-Flux Sensor |
A thin resistive or thermoelectric element detects the temperature gradient across a deposited film or multilayer structure. Some designs use resistance change; others use the Seebeck effect. |
Approximately 10 W/m² to 1 MW/m², depending on film thickness, substrate, and calibration. |
Microseconds to milliseconds for very small, low-thermal-mass designs; larger packaged units respond more slowly. |
Commonly about −50 to 300 °C; substrate and electrode materials determine the upper limit. |
Very low profile, fast response, small sensing area, and compatibility with localized measurements. |
Sensitive to surface preparation, abrasion, electromagnetic interference, drift, and local non-uniformity. |
Semiconductor devices, thin-wall structures, transient thermal testing, combustion diagnostics, and aerodynamic heating studies. |
| Calorimetric Heat-Flux Sensor |
The absorbed energy is calculated from a measured temperature rise, mass, specific heat, and exposure time, using a known thermal capacity. |
Approximately 1 to 1,000 kW/m², depending on sensor mass, exposure duration, and allowable temperature rise. |
Usually seconds to minutes. |
Determined by the calorimeter material and the maximum permissible temperature rise; high-temperature metallic designs are common. |
Simple energy balance, useful for intense radiant exposure, and less dependent on electrical sensitivity calibration. |
Not ideal for rapid transients; heat losses, changing material properties, and nonuniform exposure can introduce error. |
Fire testing, laser and radiant-source characterization, high-energy exposure testing, and safety evaluation. |
| Differential-Temperature Heat-Flux Transducer |
Heat flux is inferred from the temperature difference between two surfaces separated by a known thermal resistance, using Fourier’s law: q = −k·ΔT/L. |
Approximately 1 W/m² to 10 kW/m² in many laboratory and building applications. |
About 0.1 to 10 seconds, depending on thickness and thermal mass. |
Often about −40 to 150 °C for standard assemblies; high-temperature versions require suitable insulation and thermocouple materials. |
Straightforward physical model, useful for conductive heat transfer, and compatible with long-term monitoring. |
Requires stable thermal properties and good thermal contact; surface radiation and convection may affect the temperature gradient. |
Wall and roof studies, insulation evaluation, pipe systems, cryogenic assemblies, and thermal-management research. |
| MEMS Heat-Flux Sensor |
Microfabricated thermopiles, resistive elements, or suspended membranes detect temperature gradients across a low-thermal-mass structure. |
Commonly about 10 W/m² to 100 kW/m², depending on membrane design and packaging. |
Microseconds to milliseconds. |
Often about −40 to 125 °C for packaged electronics; specialized high-temperature packaging can extend this range. |
Very small footprint, low thermal mass, fast dynamic response, and potential for array-based spatial mapping. |
Limited overload capacity, packaging sensitivity, small active area, and possible drift from contamination or mechanical stress. |
Portable instruments, electronics cooling, gas-flow studies, thermal imaging calibration, and distributed sensor networks. |